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1.VLSI technology uses ________ to form integrated circuit ?
1.switches
2.diodes
3.transistors.
4.buffers
2.Medium scale integration has ?
1.Ten logic gates
2.hundred logic gates
3.fifty logic gates
4.thousands logic gates.
3. The difficulty in achieving high doping concentration leads to ?
1.error in variation.
2.error in concentration.
3.error in doping.
4.distrubution error.
4.________is used to deal with effect of variation ?
1.chip level technique
2.logic level technique
3. switch level technique
4.system level technique
5.architecture is used to design VLSI ?
1.system on a device
2.single open circuit
3.system on a circuit
4.system on a chip
6.As die size shrinks, the complexity of making the photomasks ?
1.decreases
2.remains the same
3.increases
4.cannot be determined
7.architecture is used to design VLSI ?
1.system on a device
2.system on a chip
3.single open circuit
4.system on a circuit.
8.________is used in logic design of VLSI ?
1.FIFO.
2.LIFO.
3.FILO.
4.LILO.
9.Which provides higher integration density ?
1.switch transistor logic
2.transistor buffer logic
3. circuit level logic
4.transistor transistor logic
10. Which is the high level representation of VLSI design ?
1.problem statement.
2.logic design.
3.HDL program.
4.functional design.
11.Physical and electrical specification is given in ?
1.architectural design
2.logic design
3.functional design
4.system design
12.Gate minimization technique is used to simplify the logic ?
1.True.
2. False.
13.What kind of substrate is provided above the barrier to dopants ?
1.insulating.
2. conducting.
3.silicon.
4.semi conducting.
14.impurities are added to the wafer of the crystal ?
1.n impurities.
2.siicon.
3.p impurities.
4.crystal
15.Heavily doped polysilicon is deposited using.?
1.chemical vapour decomposition.
2.chemical deposition.
3.chemical vapour deposition.
4.dry deposition
